Use case
Telecom Network Device Assembly
An edge router or wireless access point board. Volume 500 to 2000 units per batch. High-density BGA, multi-band RF, requires X-ray inspection and EMC pre-scan before notified-body testing.
Typical BOM characteristics
- Application processor with high-pin-count BGA
- Multi-band RF front end with antenna ports
- High-speed memory and storage
- PoE or DC power input
Test plan example
- Boundary-scan integration for BGA verification
- X-ray inspection on partner site
- RF TX and RX path verification per band
- Throughput test against reference traffic generator
- EMC pre-scan sample test
Box-build scope
- PCBA into RF-shielded housing
- External antenna integration
- Label with serial, MAC, certifications
- Pack with installation accessories
Lead-time pattern
12 weeks NPI, 6 weeks repeat batch
Scope split
What we own
- SMT assembly
- Boundary-scan test
- FCT with traffic verification
- Box-build
- X-ray coordination with partner
What you provide
- EMC pre-scan partner
- Antenna supplier
- Housing and shielding parts
Start your telecom network device RFQ
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