Capability
Soldering and reflow is the moment paste turns into electrical and mechanical connection. Profile control across the heating zones decides whether joints form correctly without thermal damage. The GF-120HT supports lead-free SAC305 with predictable horizontal convection.
Our SMT line is sized for prototype-to-low-volume production and NPI work, typically under 5000 units per batch with mixed-component boards. For higher-volume runs we plan capacity together during DFM and BOM review.
Profile loaded from up to 100 stored options based on board mass and paste type.
Board enters the 1042 mm heated tunnel at controlled speed.
Six zones (3 top + 3 bottom) ramp the board through preheat, soak, reflow, and peak.
Forced-air cooling brings board to handling temperature.
Yes. We work with RoHS-compliant component selection and SAC305 lead-free solder by default. REACH substance documentation comes from supplier declarations forwarded with each batch.
Share your BOM, gerbers, and CPL. Engineering reviews fit, throughput, and DFM, and replies within one business day.
