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Service

PCB Assembly

PCB assembly at Energetika-VDS runs through an in-house SMT PCB production line: solder paste printing, automated pick-and-place assembly, soldering and reflow, inspection, with optional firmware loading and functional testing when required. Through-hole assembly is supported as a secondary option.

What this service includes

  • Surface-mount assembly on the in-house SMT PCB production line
  • Through-hole assembly when required
  • Solder paste printing, pick-and-place, and lead-free reflow
  • Automated optical inspection against IPC-A-610 acceptance criteria
  • Optional firmware loading and functional testing
  • Optional box-build support
  • Component sourcing support when required
  • Pilot batch through repeat PCB assembly production

Production workflow for this service

  1. INPUT FILES

  2. RFQ and file review

    BOM, gerbers, CPL, and assembly drawing reviewed against the in-house line.

  3. BOM review and sourcing

    Alternates flagged, dual-source identified, sourcing arranged when required.

  4. Assembly setup

    Stencil, feeders, and reflow profile prepared for the production line.

  5. Solder paste printing

    Stencil-based deposit on the SPR-45 stencil printer.

  6. Pick-and-place assembly

    Vision-assisted placement on the LS60 pick-and-place machine.

  7. Soldering and reflow

    Six-zone horizontal convection reflow on the GF-120HT, lead-free SAC305 capable.

  8. Inspection

    AOI on every assembled board.

  9. Optional test and firmware

    Functional test or firmware loading when included in the scope.

  10. OUTPUT

Technical scope

Board size
330 to 343 mm by 304 to 813 mm
Component range
0201 to 35 mm bodies, BGA, 15 mil pitch QFP
Solder profile
Lead-free SAC305 capable
Acceptance criteria
IPC-A-610 Class 2 or Class 3
Volume range
Pilot through repeat PCB assembly, typically under 5000 units per batch

When buyers need this

  • You need a European partner for PCB assembly with in-house SMT capability.
  • You want assembly with inspection and acceptance criteria discipline on every board.
  • You want one partner for assembly plus optional test, firmware loading, and box-build.

Frequently asked questions

What is your minimum order quantity?

We work from pilot batches through repeat production. The sweet spot for our SMT line is low to medium volume, typically under 5000 units per batch with mixed-component boards. We plan capacity in advance during DFM and BOM review for larger volumes.

What lead times can we expect?

New product introduction takes about 4 to 8 weeks depending on component availability and test fixture readiness. Repeat batches typically run on a 3 to 5 week cadence once tooling and test plan are in place.

Do you manage component sourcing?

Yes. We work from your approved vendor list (AVL) or build one with you, including dual-source identification for lead-time risk. We flag obsolete or long-lead parts during DFM review and propose alternates when needed.

Which design files do you accept?

Gerber RS-274X, ODB++, and IPC-2581 for PCB data. BOM in xlsx or csv with manufacturer part numbers. CPL or pick-and-place file in csv or txt. Step files for enclosures. Firmware binaries as hex, bin, or signed image bundles.

How is solder joint quality verified?

Automated optical inspection runs on every assembled board against IPC-A-610 acceptance criteria. We support Class 2 and Class 3 inspection profiles. X-ray inspection is available through partner labs for BGA and high-density boards when required.

Quote pcb assembly

Send your BOM, gerbers, and CPL. We respond within one business day. NDA on request.

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