Capability
Inspection and Testing
Inspection catches placement and joint defects. Functional testing catches behavioral defects. Together they verify that the unit leaving the in-house production line will work in the field.
Process detail
- STAGE INPUT
-
AOI
Camera inspection of every joint and component against IPC-A-610 criteria.
-
X-ray (partner)
BGA and high-density boards routed to partner X-ray when required.
-
Functional test (FCT)
Custom or adapted bed-of-nails or edge-connector fixture, sequence per your test plan.
-
Pass and fail logging
Per-unit results captured with serial and firmware hash.
- STAGE OUTPUT
Files we accept
- Test plan document
- FCT vector list
- Reference unit (golden sample)
- Test fixture CAD if existing
Tolerances and specs
- AOI coverage
- Every board
- Acceptance
- IPC-A-610 Class 2 or Class 3
- FCT cycle time
- 30 to 90 s typical
Frequently asked questions
How is solder joint quality verified?
Automated optical inspection runs on every assembled board against IPC-A-610 acceptance criteria. We support Class 2 and Class 3 inspection profiles. X-ray inspection is available through partner labs for BGA and high-density boards when required.
Do we need a written test plan?
Yes. A production test plan defines pass and fail criteria, FCT vectors, calibration steps, and serialization rules. We help draft one if your team has not written one yet, based on your firmware behavior and target field performance.
How do you handle defects and rework?
Defects flagged during AOI or functional test are root-caused and either reworked under IPC-7711/7721 procedures or scrapped depending on root cause. Failure data feeds back into DFM review for the next batch.
Discuss this capability
Share your BOM, gerbers, and CPL. Engineering reviews fit, throughput, and DFM, and replies within one business day.