Energetika-VDS Request a Quote

Manufacturing process

From RFQ to shipment, as one routed signal

Every unit moves through defined production, firmware, test, and quality gates. Each stage hands the unit to the next with verification at every junction.

The full routed flow

  1. RFQ INPUT

  2. RFQ

    Quote review against your BOM, gerbers, and CPL. Capacity and DFM check before we commit.

  3. DFM and BOM

    Design-for-manufacturing analysis, alternate part proposals, dual-source identification, AVL alignment.

  4. Component sourcing

    Procurement against the AVL with lead-time risk flagging.

  5. Solder paste printing

    DDM Novastar SPR-45 stencil printer, dual squeegee, 16 by 18 inch print area.

  6. Pick-and-place

    DDM Novastar LS60, vision-assisted placement across 96 to 144 feeders.

  7. Reflow soldering

    DDM Novastar GF-120HT, six-zone horizontal convection, lead-free SAC305 capable.

  8. AOI

    Automated optical inspection of placement and joints against IPC-A-610 acceptance criteria.

  9. Firmware flashing

    In-line or offline programming with multi-image support and signed bootloader chains.

  10. Functional test (FCT)

    Bed-of-nails or edge-connector fixtures against your test plan, per-unit pass and fail logging.

  11. Secure provisioning

    X.509 enrollment, secure-element key injection, eFuse or OTP burn where required.

  12. Serialization and labeling

    MAC, UID, or serial assigned, GS1 DataMatrix or QR labels applied.

  13. Box-build

    Sub-assembly into housing, cabling, gasketing, antenna placement, mechanical integration.

  14. Final QC

    Sample IP rating verification, label verification, batch sign-off.

  15. Shipment

    Programmed, tested, serialized, packed units leave the line ready for the field.

  16. SHIPMENT OUTPUT

Quality and verification at each gate

  • IPC-A-610 acceptance criteria applied per board

    Class 2 or Class 3 inspection profile selected per project.

  • AOI on every assembled board

    Camera-based inspection of solder joints and component placement.

  • FCT against your test plan

    Per-unit pass and fail logging tied to serial number.

  • Per-unit traceability database

    Serial, firmware hash, batch, operator, machine program logged for every unit.

  • Lead-free solder profile

    SAC305 reflow profile, RoHS compliant by default.

  • Defect routing and root cause

    Failures quarantined, reworked under IPC-7711 procedures or scrapped.

See your product through this flow

Send files. We map them to each stage and reply with a quote within one business day.

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